
If you do not evenly coat the glue, those weak adhesion areas will upwarp after a few layers.
Dust and a certain amount of 3D printing will decrease adhesion of the glue on the build plate.
So to solve the problem, please clean the build plate and evenly coat/spray the glue again.
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If the probe of the leveling sensor is bent, please bend it back to be straight. Or you just replace it with a new probe.
If you have changed the settings in the slicer, please check if the "line width" is included.
To 3D print with a big "Line Width", you need to set a bigger first layer height and a bigger Z-offset, otherwise, you will encounter a situation like this: ↓
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To 3D print with a small "Line Width", you need to set a smaller Z-offset, otherwise, you will encounter situations like this:
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We would recommend you to 3D print with the default settings in FormLetter slicer.